NF EN 61191-6
Printed board assemblies - Part 6 : evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
| Edition date: |
2010-07-01
In Force
|
|---|---|
| Available languages: | English, Francés |
| Keywords: | ELECTRONIC COMPONENTS|SMD|WELDING|PRINTED-CIRCUIT CARDS|ELECTRICAL CASES|JOINING|WELDED JOINTS|BRAZED-AND SOLDERED JOINTS|VACUUM MEASUREMENT|DETECTION|RELIABILITY |
| ICS: | 31.180-Printed circuits and boards, 31-ELECTRONICS |
| CTN: |
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