IEC 61189-2-803:2023
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards
| Edition date: |
2023-07-26
In Force
|
|---|---|
| Available languages: | English, Francés |
| ICS: | 31.180-Printed circuits and boards |
| CTN: | 1286 |
|
Otras Relaciones |
Acuerdo de Frankfurt prEN IEC 61189-2-803:2021 |
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