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IEC
IEC TS 61967-3:2014
En Vigor
2014-08-25
Integrated circuits - Measurement of electromagnetic emissions - Part 3:
Measurement of radiated emissions - Surface scan method
IEC
IEC 62830-8:2021
En Vigor
2021-10-22
Semiconductor devices - Semiconductor devices for energy harvesting and
generation - Part 8: Test and evaluation methods of flexible and
stretchable supercapacitors for use in low power electronics
IEC
IEC
IEC 60803:1984
En Vigor
1984-01-01
Recommended dimensions for hexagonal and square crimping-die cavities,
indentors, ganges, outer conductor crimp sleeves and centre contact
crimp barrels for R.F. cables and connectors
