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IEC
IEC 61249-2-31:2009
En Vigor
2009-02-11
Materials for printed boards and other interconnecting structures - Part
2-31: Reinforced base materials, clad and unclad - Halogenated modified
or unmodified resin system, woven E-glass laminate sheets of defined
relative permittivity (equal to or less than 4,1 at 1 GHz) and
flammability (vertical burning test), copper-clad
IEC
IEC 61190-1-3:2017
En Vigor
2017-12-13
Attachment materials for electronic assembly - Part 1-3: Requirements
for electronic grade solder alloys and fluxed and non-fluxed solid
solder for electronic soldering applications
IEC
IEC 62321-6:2015
En Vigor
2015-06-05
Determination of certain substances in electrotechnical products - Part
6: Polybrominated biphenyls and polybrominated diphenyl ethers in
polymers by gas chromatograhy -mass spectometry (GC-MS)
IEC
IEC 61784-1-2:2023
En Vigor
2023-03-22
Industrial networks - Profiles - Part 1-2: Fieldbus profiles -
Communication Profile Family 2
