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IEC
IEC 61188-6-4:2019
En Vigor
2019-05-02
Printed boards and printed board assemblies - Design and use - Part 6-4:
Land pattern design - Generic requirements for dimensional drawings of
surface mounted components (SMD) from the viewpoint of land pattern design
IEC
IEC 60191-6-13:2016
En Vigor
2016-09-27
Mechanical standardization of semiconductor devices - Part 6-13: Design
guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA)
and Fine-pitch Land Grid Array (FLGA)
IEC
IEC 61249-4-11:2005
En Vigor
2005-09-22
Materials for printed boards and other interconnecting structures - Part
4-11: Sectional specification set for prepreg materials, unclad -
Non-halogenated epoxide, woven E-glass prepreg of defined flammability
IEC
IEC 62040-3:2021
En Vigor
2021-04-21
Uninterruptible power systems (UPS) - Part 3: Method of specifying the
performance and test requirements
