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IEC
IEC TS 62610-1:2009
En Vigor
2009-09-16
Mechanical structures for electronic equipment - Thermal management for
cabinets in accordance wit IEC 60297 and IEC 60917 series - Part 1:
Design guide: Interface dimension and provision for thermoelectrical
cooling systems (Peltier effect)
IEC
IEC 60191-2:1966/AMD14:2006
En Vigor
2006-07-17
Amendment 14 - Mechanical standardization of semiconductor devices -
Part 2: Dimensions
IEC
IEC 60433:2021 RLV
En Vigor
2021-01-12
Insulators for overhead lines with a nominal voltage above 1000 V -
Ceramic insulators for AC systems - Characteristics of insulator units
of the long rod type
IEC
IEC TS 62647-2:2012
En Vigor
2012-11-29
Process management for avionics - Aerospace and defence electronic
systems containing lead-free solder - Part 2: Mitigation of deleterious
effects of tin
IEC
IEC 60748-3:1986/AMD1:1991
En Vigor
1991-11-15
Amendment 1 - Semiconductor devices. Integrated circuits. Part 3:
Analogue integrated circuits
ISO
ISO/IEC 10514-1:1996
En Vigor
1996-05-30
Information technology — Programming languages — Part 1: Modula-2, Base Language
IEC
IEC 61540:2023
En Vigor
2023-07-19
Portable residual current devices (PRCDs) without integral overcurrent
protection for household and similar use
IEC
IEC TS 62933-3-2:2023
En Vigor
2023-01-06
Electrical energy storage (EES) systems - Part 3-2: Planning and
performance assessment of electrical energy storage systems - Additional
requirements for power intensive and renewable energy sources
integration related applications
