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IEC
IEC 62047-34:2019
En Vigor
2019-04-05
Semiconductor devices - Micro-electromechanical devices - Part 34: Test
methods for MEMS piezoresistive pressure-sensitive device on wafer
IEC
IEC 62952-2:2016
En Vigor
2016-10-05
Power sources for a wireless communication device - Part 2: Profile for
power modules with batteries
IEC
IEC 60721-3-7:1987/AMD1:1991
Anulada
1995-01-25
Amendment 1 - Classification of environmental conditions - Part 3-7:
Classification of groups of environmental parameters and their
severities - Portable and non-stationary use
IEC
IEC 60352-2:1990/AMD2:2002
Anulada
2006-02-23
Amendment 2 - Solderless connections. Part 2: Solderless crimped
connections - General requirements, test methods and practical guidance
