Mechanical standardization of semiconductor devices - Part 6-5: General
rules for the preparation of outline drawings of surface mounted
semiconductor device packages - Design guide for fine-pitch ball grid
array (FBGA)
Information technology — Volume and file structure of write-once and
rewritable media using non-sequential recording for information
interchange — Part 5: Record structure
Fixed capacitors for use in electronic equipment - Part 19: Sectional
specification: Fixed metallized polyethylene-terephthalate film
dielectric chip d.c. capacitors