Specification for solventless polymerisable resinous compounds used for
electrical insulation. Part 3: Specifications for individual materials.
Sheet 11: Epoxy resin-based coating powders
Connectors for use in d.c. low-frequency analogue and digital high speed
data applications - Part 4-103: Printed board connectors with assessed
quality - Detail specification for two-part connectors with shielding
and a basic grid of 2,5 mm