NF EN 61189-5-503
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503 : general test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
| Edition date: |
2017-08-11
In Force
|
|---|---|
| Available languages: | English, Francés |
| Keywords: | ELECTRONIC COMPONENTS|PRINTED-CIRCUIT CARDS|PRINTED-CIRCUIT BOARDS|MATERIALS|JOINING|ELECTRIC CONDUCTORS|ANODES|TESTS|TESTING CONDITIONS|TEST SPECIMENS|MEASUREMENT|INSULATION RESISTANCE|CYCLIC TESTS|THERMAL CYCLING TESTS|DAMP HEAT TESTS| |
| ICS: | 31.180-Printed circuits and boards |
| CTN: | |
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International Equivalence |
Identic EN 61189-5-503:2017 Identic IEC 61189-5-503:2017 |
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