NF EN IEC 61189-2-807
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807 : test methods for materials for interconnection structures - Decomposition temperature ( Td) using TGA
| Fecha edición: |
2021-10-15
En Vigor
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| Idiomas disponibles: | Inglés, Francés |
| Keywords: | PRINTED-CIRCUIT BOARDS|PRINTED-CIRCUIT CARDS|CIRCUIT INTERCONNECTION|COMPOSITE MATERIALS|LAMINATES|TEMPERATURE|DECOMPOSITION|TESTS|THERMOGRAVIMETRIC ANALYSIS|TEST SPECIMENS|CALIBRATION|INSTRUMENTATION RECORDING |
| ICS: | 31.180 - Tarjetas y circuitos impresos, 31 - ELECTRONICA |
| CTN: |
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