NF EN IEC 61189-5-601
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601 : general test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
| Fecha edición: |
2021-06-18
En Vigor
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| Idiomas disponibles: | Inglés, Francés |
| Keywords: | PRINTED-CIRCUIT BOARDS|PRINTED-CIRCUIT CARDS|BRAZING-AND SOLDERING|BRAZED-AND SOLDERED JOINTS|ALLOYS|THERMAL RESISTANCE|JOINING|TESTS|MEASUREMENT|TEST EQUIPMENT|SPECIMEN PREPARATION|PROCEDURE|DIMENSIONAL DEVIATIONS|THICKNESS|WETTING |
| ICS: | 31.180 - Tarjetas y circuitos impresos, 31 - ELECTRONICA |
| CTN: |
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