DIN 50002-1:2020-03
Adhesive bondings in electronic applications - Bonding strength on surfaces - Part 1: Tensile test
| Fecha edición: |
2020-03-01
En Vigor
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|---|---|
| Idiomas disponibles: | Inglés, Alemán |
| Resumen: | This standard specifies a test method for the assessment of the bondability of elements and for the determination of adhesive and compound characteristics using a cross tension test with tensile members such as headnails, pins and dollies. |
| Keywords: | Adhesion|Adhesive strength|Adhesives|Bonding|Components|Compounds|Definitions|Electronic engineering|Electronic equipment and components|Fragmentation tests|Gellings|Materials testing|Sample preparation|Specimens|Surfaces|Tensile tests|Test performance|Testing|Testing devices |
| ICS: | 83.180 - Adhesivos, 31.020 - Componentes electrónicos en general |
| CTN: | |
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Reemplazo Normas |
Reemplaza a DIN 50002-1:2019-07 |
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