DIN EN 60191-6-1:2002-08
Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for gull-wing lead terminals (IEC 60191-6-1:2001); German version EN 60191-6-1:2001 / Note: To be replaced by DIN IEC 60191-6-1 (2010-07).
| Fecha edición: |
2002-08-01
En Vigor
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| Idiomas disponibles: | Alemán |
| Resumen: | The document covers the requirements for the design rule of terminal shape plastic packages with gull-wing leads; e.g., QFP, SOP, SSOP, TSOP, etc. which are packages classified as Form E in IEC 60191-4. This publication is intended to establish common rules on terminal shapes irrespective of package types. Das Dokument enthält die Anforderungen für die Gestaltung von Anschlussformen für Kunststoffgehäuse mit Gullwing-Anschlüssen, z. B. QFP, SOP, SSOP, TSOP, die in IEC 60191-4 als Gehäuse der Form E klassifiziert sind. Diese Norm stellt allgemeine Regeln für Anschlussformen unabhängig von Gehäusetypen auf. |
| Keywords: | Case drawing|Definitions|Design|Dimensions|Drawings|Electric enclosures|Electrical engineering|Electronic engineering|Electronic equipment and components|Enclosures|Engineering drawings|Illustrations|Integrated circuits|Marking|Mechanic|Semiconductor devices|Semiconductor package|Semiconductors|Standardization |
| ICS: | 31.240 - Estructuras mecánicas para equipos electrónicos, 01.100.25 - Dibujos de electrónica y electrotecnia |
| CTN: | |
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Equivalencia Internacional |
Idéntica EN 60191-6-1:2001 Idéntica IEC 60191-6-1:2001 |
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Reemplazo Normas |
Reemplaza a DIN IEC 47D/255/CDV:1999-04 |
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