DIN EN 60191-6-19:2010-10
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage (IEC 60191-6-19:2010); German version EN 60191-6-19:2010
| Fecha edición: |
2010-10-01
En Vigor
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| Idiomas disponibles: | Alemán |
| Resumen: | This part of DIN EN 60191 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array (BGA), Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA). Dieser Teil von DIN EN 60191 legt die Messverfahren für die Gehäuseverbiegung bei erhöhter Temperatur und die maximal zulässigen Verbiegungen für Ball-Grid-Array (BGA), Feinraster-Ball-Grid-Array (FBGA) und Feinraster-Land-Grid-Array (FLGA) fest. |
| Keywords: | Ball Grid Array|Bendings|Criterion|Definitions|Deflection|Deformation|Electric enclosures|Electrical engineering|Electronic engineering|Electronic equipment and components|Enclosures|Integrated circuits|Lasers|Measurement|Measuring techniques|Mechanic|Mechanical measurement|Mechanical testing|Mechanics|Moire|Prominences|Random samples|Semiconductor devices|Semiconductor package|Semiconductors|SMD|Surface mounting|Surface mounting devices|Temperature|Temperature measurement |
| ICS: | 31.240 - Estructuras mecánicas para equipos electrónicos |
| CTN: | |
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Equivalencia Internacional |
Idéntica EN 60191-6-19:2010 Idéntica IEC 60191-6-19:2010 |
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Reemplazo Normas |
Reemplaza a DIN IEC 60191-6-19:2008-03 |
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