DIN EN 60191-6-20:2011-03
Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 60191-6-20:2010); German version EN 60191-6-20:2010
| Fecha edición: |
2011-03-01
En Vigor
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| Idiomas disponibles: | Alemán |
| Resumen: | This part of DIN EN 60191 specifies (or: covers) methods to measure package dimensions of small outline J-lead-packages (SOJ), package outline form E in accordance to IEC 60191-4. Dieser Teil von DIN EN 60191 (beinhaltet bzw.) legt Verfahren zur Messung der Maße von kleinen Gehäusen mit J-förmigen Anschlüssen (SOJ) fest, die der Bauform E nach IEC 60191-4 entsprechen. |
| Keywords: | Case drawing|Components|Connecting dimensions|Connections|Design|Dimensions|Drawings|Electric enclosures|Electrical engineering|Electronic engineering|Electronic equipment and components|Enclosures|Engineering drawings|Erecting (construction operation)|Grid systems|Illustrations|Integrated circuits|Marking|Matrices|Mechanic|Packages|Semiconductor devices|Semiconductor package|Semiconductors|SMD|Surface mounting|Surface mounting devices|Symbols|Types |
| ICS: | 31.240 - Estructuras mecánicas para equipos electrónicos, 01.100.25 - Dibujos de electrónica y electrotecnia |
| CTN: | |
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Equivalencia Internacional |
Idéntica EN 60191-6-20:2010 Idéntica IEC 60191-6-20:2010 |
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Reemplazo Normas |
Reemplaza a DIN IEC 60191-6-20:2009-02 |
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