DIN EN 60191-6-22:2013-08
Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) (IEC 60191-6-22:2012); German version EN 60191-6-22:2013
| Fecha edición: |
2013-08-01
En Vigor
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| Idiomas disponibles: | Alemán |
| Resumen: | This part from IEC 60191 provides the outline drawings and dimensions common to siliconbased package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA). Dieser Teil der IEC 60191 enthält die Gehäusezeichnungen und Abmessungen, die alle Bauarten und Werkstoffe von Gehäusen für Ball-Grid-Arrays (BGA) und Land-Grid-Arrays (LGA) auf Si-Basis gemein haben. |
| Keywords: | Ball Grid Array|Case drawing|Components|Connecting dimensions|Connections|Definitions|Design|Dimensions|Drawings|Electric enclosures|Electrical engineering|Electronic engineering|Electronic equipment and components|Enclosures|Engineering drawings|Erecting (construction operation)|Grid systems|Integrated circuits|Land Grid Array|Marking|Measurement|Measuring techniques|Mechanic|Numbering|Packages|Semiconductor devices|Semiconductor package|Semiconductors|SMD|Surface mounting|Surface mounting devices|Symbols|Types |
| ICS: | 31.240 - Estructuras mecánicas para equipos electrónicos, 01.100.25 - Dibujos de electrónica y electrotecnia |
| CTN: | |
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Equivalencia Internacional |
Idéntica EN 60191-6-22:2013 Idéntica IEC 60191-6-22:2012 |
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Reemplazo Normas |
Reemplaza a DIN EN 60191-6-22:2011-08 |
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