DIN EN 60191-6-3:2001-06
Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quat flat packs (QFP) (IEC 60191-6-3:2000); German version EN 60191-6-3:2000
| Fecha edición: |
2001-06-01
En Vigor
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|---|---|
| Idiomas disponibles: | Alemán |
| Resumen: | The document stipulates a method for quad flat packs (QFP) measuring dimensions which are classified into Form E. Das Dokument legt ein Verfahren zur Messung von Maßen von QFP-Gehäusen fest, die als Form E klassifiziert sind. |
| Keywords: | Case drawing|Components|Connections|Definitions|Design|Dimensions|Drawings|Electric enclosures|Electrical engineering|Electronic engineering|Electronic equipment and components|Enclosures|Engineering drawings|Illustrations|Measurement|Measuring techniques|Mechanic|Multilingual|Properties|Representations|Semiconductor devices|Semiconductor package|Semiconductors|Standardization|Surface mounting|Surface mounting devices |
| ICS: | 31.240 - Estructuras mecánicas para equipos electrónicos, 01.100.25 - Dibujos de electrónica y electrotecnia |
| CTN: | |
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Equivalencia Internacional |
Idéntica EN 60191-6-3:2000 Idéntica IEC 60191-6-3:2000 |
|
Reemplazo Normas |
Reemplaza a DIN IEC 47D/221/CDV:1998-08 |
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