DIN EN 60749-16:2003-09
Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND) (IEC 60749-16:2003); German version EN 60749-16:2003
| Fecha edición: |
2003-09-01
En Vigor
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| Idiomas disponibles: | Alemán |
| Resumen: | The test described in this standard is used to detet the presence of loose particles inside a cavity device, such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills). Die Prüfung nach dieser Norm dient dem Nachweis des Vorhandenseins von losen Teilchen in einem Hohlraum-Bauelement wie beispielsweise Keramiksplitter, Bonddrahtteile oder Lötperlen (Prills). |
| Keywords: | Climate|Climatic tests|Components|Electrical engineering|Electrical measurement|Electronic engineering|Electronic equipment and components|Environmental testing|Impurities|Impurity|Integrated circuits|Mechanical testing|Noise|Noise measurement|Particulate matter|Semiconductor devices|Semiconductors|Testing |
| ICS: | 31.080.01 - Dispositivos semiconductores en general |
| CTN: | |
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Equivalencia Internacional |
Idéntica EN 60749-16:2003 Idéntica IEC 60749-16:2003 |
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Reemplazo Normas |
Reemplaza a DIN EN 60749-16:2002-05 |
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