DIN EN 60749-33:2004-09
Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave (IEC 60749-33:2004); German version EN 60749-33:2004
| Fecha edición: |
2004-09-01
En Vigor
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| Idiomas disponibles: | Alemán |
| Resumen: | The unbiased autoclave test is performed to evaluate the moisture resistance integrity of non-hermetic packaged solid-state devices using moisture condensing or moisture saturated steam environments. Das Autoklav-Prüfverfahren ohne elektrische Beanspruchung wird verwendet, um die Feuchtebeständigkeit von nicht hermetisch verkappten Halbleiterbauelementen unter Anwendung von kondensierenden oder dampfgesättigten feuchten Umgebungen zu beurteilen. |
| Keywords: | Autoclave process|Autoclaves|Bond strength|Climatic tests|Components|Definitions|Destructive testing|Electrical engineering|Electrical measurement|Electronic engineering|Electronic equipment and components|Environmental testing|Environmental tests|Integrated circuits|Mechanical testing|Moisture resistance|Resistance|Semiconductor devices|Semiconductors|Testing|Testing conditions |
| ICS: | 31.080.01 - Dispositivos semiconductores en general |
| CTN: | |
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Equivalencia Internacional |
Idéntica EN 60749-33:2004 Idéntica IEC 60749-33:2004 |
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Reemplazo Normas |
Reemplaza a DIN IEC 60749-33:2002-10 |
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