DIN EN 61189-5-2:2015-11
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies (IEC 61189-5-2:2015); German version EN 61189-5-2:2015 / Note: DIN EN 61189-5 (2007-05) remains valid alongside this standard until 2018-02-12.
| Fecha edición: |
2015-11-01
En Vigor
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| Idiomas disponibles: | Alemán |
| Resumen: | This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. Dieser Teil von IEC 61189 ist ein Katalog von Prüfverfahren, die methodische Verfahren und Prüfabläufe darstellen, die bei der Prüfung bestückter Leiterplatten angewandt werden können. |
| Keywords: | Accuracy|Assemblies|Checking equipment|Corrosion tests|Electrical components|Electrical engineering|Electronic equipment and components|Equipment|Fluxes (materials)|Insulating resistance|Interconnection|Interconnection structures|Mechanical testing|Methods|Precision|Printed circuits|Printed-circuit boards|Procedures|Qualification tests|Soldering|Test reports|Testing|Testing devices|Viscosity |
| ICS: | 31.180 - Tarjetas y circuitos impresos |
| CTN: | |
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Equivalencia Internacional |
Idéntica EN 61189-5-2:2015 Idéntica IEC 61189-5-2:2015 |
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Reemplazo Normas |
Reemplaza a DIN EN 61189-5-2:2013-04 |
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