DIN EN 61189-5-4:2015-11
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies (IEC 61189-5-4:2015); German version EN 61189-5-4:2015 / Note: DIN EN 61189-5 (2007-05) remains valid alongside this standard until 2018-02-12.
| Fecha edición: |
2015-11-01
En Vigor
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|---|---|
| Idiomas disponibles: | Alemán |
| Resumen: | IEC 61189 relates to test methods for materials or component robustness for printed board assemblies, irrespective of their method of manufacture. Dieser Teil von IEC 61189 ist ein Katalog von Prüfverfahren, die methodische Verfahren und Prüfabläufe darstellen, die bei der Prüfung bestückter Leiterplatten angewandt werden können. |
| Keywords: | Alloys|Assemblies|Checking equipment|Corrosion tests|Determination|Electrical components|Electrical engineering|Electronic equipment and components|Equipment|Filler wires|Fluxes (materials)|Insulating resistance|Interconnection|Interconnection structures|Mechanical testing|Methods|Precision|Printed circuits|Printed-circuit boards|Procedures|Qualification tests|Solder alloys|Solder wires|Soldering|Soldering pastes|Test reports|Testing|Testing devices|Viscosity|Wires |
| ICS: | 31.180 - Tarjetas y circuitos impresos |
| CTN: | |
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Equivalencia Internacional |
Idéntica EN 61189-5-4:2015 Idéntica IEC 61189-5-4:2015 |
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Reemplazo Normas |
Reemplaza a DIN EN 61189-5-4:2013-07 |
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