DIN EN 61191-6:2011-01
Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method (IEC 61191-6:2010); German version EN 61191-6:2010
| Fecha edición: |
2011-01-01
En Vigor
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| Idiomas disponibles: | Alemán |
| Resumen: | This part of IEC 61191 specifies the evaluation criteria for voids on the scale of the thermal cycle life, and the measurement method of voids using X-ray observation. This part of IEC 61191 is applicable to the voids generated in the solder joints of BGA and LGA soldered on a board. This part of IEC 61191 is not applicable to the BGA package itself before it is assembled on a board. |
| Keywords: | Cavity|Definitions|Electrical engineering|Electrically-operated devices|Electronic engineering|Electronic equipment and components|Electronically-operated devices|Evaluations|Measurement|Measuring techniques|Printed circuits|Printed-circuit boards|Sectional specification|SMD|Soldered|Soldered joints|Solderings|Specification|Specification (approval)|Surface mounting|X-ray|X-ray analysis |
| ICS: | 31.180 - Tarjetas y circuitos impresos |
| CTN: | |
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Equivalencia Internacional |
Idéntica EN 61191-6:2010 Idéntica IEC 61191-6:2010 |
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Reemplazo Normas |
Reemplaza a DIN IEC 61191-6:2007-12 |
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