DIN EN 61249-3-4:1999-11
Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards); adhesive coated flexible polyimide film (IEC 61249-3-4:1999); German version EN 61249-3-4:1999
| Fecha edición: |
1999-11-01
En Vigor
|
|---|---|
| Idiomas disponibles: | Alemán |
| Resumen: | The document gives requirements for flexible polyimide films coated on one side or both with adhesive of acrylic or epoxy base for use in the fabrication of flexible printed wiring. Das Dokument enthält Anforderungen für ein- oder beidseitig mit Kleber auf Acryl- oder Epoxidharzbasis beschichtete flexible Polyimidfolien zur Herstellung von flexiblen Leiterplatten. |
| Keywords: | Adhesive|Adhesives|Base materials|Conductive materials|Conductivity|Electric conductors|Electrical engineering|Flexible materials|Interconnection structures|Polyimides|Printed circuits|Printed-circuit boards |
| ICS: | 31.180 - Tarjetas y circuitos impresos |
| CTN: | |
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Equivalencia Internacional |
Idéntica EN 61249-3-4:1999 Idéntica IEC 61249-3-4:1999 |
|
Reemplazo Normas |
Reemplaza a DIN IEC 52/521/CD:1995-04 |
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