DIN EN 61249-8-8:1998-01
Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings; Section 8: Temporary polymer coatings (IEC 61249-8-8:1997); German version EN 61249-8-8:1997
| Fecha edición: |
1998-01-01
En Vigor
|
|---|---|
| Idiomas disponibles: | Alemán |
| Resumen: | The document details requirements for the qualification of temporary solder resist coatings. Das Dokument enthält Anforderungen zur Qualitätsbewertung von temporären Lötabdeckungen. |
| Keywords: | Base materials|Coatings|Electrical engineering|Electronic equipment and components|Evaluations|Films|Interconnection structures|Materials|Nonconducting|Polymers|Printed circuits|Quality|Sectional specification|Specification (approval) |
| ICS: | 31.180 - Tarjetas y circuitos impresos |
| CTN: | |
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Equivalencia Internacional |
Idéntica EN 61249-8-8:1997 Idéntica IEC 61249-8-8:1997 |
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