DIN EN 62047-14:2012-10
Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials (IEC 62047-14:2012); German version EN 62047-14:2012
| Fecha edición: |
2012-10-01
En Vigor
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| Idiomas disponibles: | Alemán |
| Resumen: | This part of DIN EN 62047 describes definitions and procedures for measuring the forming limit of metallic film materials with a thickness range from 0,5 µm to 300 µm. The metallic film materials described herein are typically used in electric components, MEMS and micro-devices. |
| Keywords: | Definitions|Electrical engineering|Form changes|Forming forces|Forming method|Material behaviour|Materials|Metal films|Metallic|Microelectronics|Microsystem techniques|Properties|Semiconductor devices|System engineering|Testing|Thickness|Thin films|Thin-film technology |
| ICS: | 31.080.01 - Dispositivos semiconductores en general, 31.220.01 - Componentes electromecánicos en general |
| CTN: | |
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Equivalencia Internacional |
Idéntica EN 62047-14:2012 Idéntica IEC 62047-14:2012 |
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Reemplazo Normas |
Reemplaza a DIN EN 62047-14:2010-10 |
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