DIN EN 62047-22:2015-04
Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates (IEC 62047-22:2014); German version EN 62047-22:2014
| Fecha edición: |
2015-04-01
En Vigor
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| Idiomas disponibles: | Alemán |
| Resumen: | This document specifies a tensile test method to measure electromechanical properties of conductive thin micro-electromechanical systems (MEMS) materials bonded on non-conductive flexible substrates. In diesem Dokument ist ein Zug-Prüfverfahren festgelegt, um elektromechanische Eigenschaften von leitfähigen dünnen Werkstoffen der Mikrosystemtechnik zu messen, die auf nicht leitfähigen flexiblen Substraten gebondet wurden. |
| Keywords: | Base materials|Components|Conductive|Definitions|Dimensions|Electrical engineering|Electromechanics|Materials|Measurement|Measuring techniques|Mechanical properties|Microelectronics|Microsystem techniques|Properties|Samples|Semiconductor devices|Substrates (coating)|System engineering|Tensile testing|Tensile tests|Testing|Testing conditions|Testing system|Thin films|Thin-film devices|Thin-film technology |
| ICS: | 31.080.01 - Dispositivos semiconductores en general, 31.220.01 - Componentes electromecánicos en general |
| CTN: | |
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Equivalencia Internacional |
Idéntica EN 62047-22:2014 Idéntica IEC 62047-22:2014 |
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Reemplazo Normas |
Reemplaza a DIN EN 62047-22:2012-11 |
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