DIN EN 62137-1-3:2009-07
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test (IEC 62137-1-3:2008); German version EN 62137-1-3:2009
| Fecha edición: |
2009-07-01
En Vigor
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| Idiomas disponibles: | Alemán |
| Resumen: | The test method described in this part of IEC 62137 applies to solder joints between terminals of surface mounting devices (SMDs) and land patterns on printed wiring boards (PWBs). Die vorliegende Norm gilt für zyklische Fallprüfungen für Lötverbindungen zwischen Anschlüssen von oberflächenmontierbaren Bauelementen (nachfolgend mit SMD bezeichnet) und Anschlussflächen auf Leiterplatten (PWB). |
| Keywords: | Bend testing|Changes of temperature|Continuity tests|Definitions|Discrete devices|Drop tests|Durability|Electrical engineering|Electronic engineering|Electronic equipment and components|Endurance testing|Endurance tests|Environmental testing|Integrated circuits|Life (durability)|Materials testing|Multilingual|Operating temperatures|Reliability|Semiconductor devices|SMD|Soldered joints|Soldering points|Surface mounting|Surface mounting devices|Temperature cycles|Temperature resistant|Test on changes of temperature|Testing|Thermal cycling|Thermal shock endurance|Thermal shock resistance |
| ICS: | 31.020 - Componentes electrónicos en general |
| CTN: | |
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Equivalencia Internacional |
Idéntica EN 62137-1-3:2009 Idéntica IEC 62137-1-3:2008 |
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Reemplazo Normas |
Reemplaza a DIN IEC 62137-1-3:2006-12 |
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