Using Artificial Intelligence (AI) on ASTM standards and related intellectual property is prohibited. Violations will result in suspension of access.
Escribe aquí el texto del aviso...test1
Escribe aquí el texto del aviso...test5 (no permite cerrarlo)
Escribe aquí el texto del aviso...test2
Escribe aquí el texto del aviso...test3
DIN EN 62137-1-5:2010-01
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-5: Mechanical shear fatigue test (IEC 62137-1-5:2009); German version EN 62137-1-5:2009
| Fecha edición: |
2010-01-01
En Vigor
|
|---|---|
| Idiomas disponibles: | Alemán |
| Resumen: | The test method described in this part of IEC 62137 applies to area array packages, such as BGA. Das in diesem Teil der IEC 62137 beschriebene Prüfverfahren ist anzuwenden für ein oberflächenmontierbares Bauelement mit einer dünnen und breiten Grundfläche, wie BGA. |
| Keywords: | Alloys|Changes of temperature|Components|Continuity tests|Cyclic|Definitions|Discrete devices|Durability|Electrical engineering|Electronic engineering|Electronic equipment and components|Endurance testing|Environmental condition|Environmental testing|Fatigue behaviour|Hot dip coating|Integrated circuits|Land pattern|Lead free|Life (durability)|Materials testing|Mechanical properties|Printed circuits|Printed-circuit boards|Reliability|Semiconductor devices|Shear strength|Shear stress|SMD|Soldered joints|Soldering points|Solderings|Surface mounting|Surface mounting devices|Testing|Testing conditions|Thermal cycling |
| ICS: | 31.020 - Componentes electrónicos en general |
| CTN: | |
|
Equivalencia Internacional |
Idéntica EN 62137-1-5:2009 Idéntica IEC 62137-1-5:2009 |
|
Reemplazo Normas |
Reemplaza a DIN IEC 62137-1-5:2007-10 |
Normas citadas
Libros relacionados
Normas relacionadas
Colecciones temáticas relacionadas
