DIN EN 62137-4:2015-07
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices (IEC 62137-4:2014); German version EN 62137-4:2014 + AC:2015 / Note: DIN EN 62137 (2005-04) remains valid alongside this standard until 2017-11-13.
| Fecha edición: |
2015-07-01
En Vigor
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| Idiomas disponibles: | Alemán |
| Resumen: | This part of IEC 62137 specifies the test method to evaluate for solder joint durability of area array type packages against thermo-mechanical stress which are applied to solder joints while they are mounted on the printed wiring board. Dieser Teil von IEC 62137 beschreibt das Prüfverfahren zur Bewertung der Beständigkeit von Lötverbindungen von Bauteilgehäusen mit Flächenmatrix gegenüber thermomechanischer Beanspruchung, der die Lötverbindungen ausgesetzt sind, wenn sie auf der Leiterplatte montiert sind. |
| Keywords: | Assemblies|Bend testing|Bending strength|Definitions|Durability|Electrical components|Electrical engineering|Electronic engineering|Electronic equipment and components|Endurance tests|Environmental tests|Erecting (construction operation)|Influence of temperature|Joint strength|Lead free|Loading|Materials testing|Mechanical properties|Properties|Reliability testing|SMD|Soldered joints|Soldering points|Solders|Surface mounting|Temperature cycles|Temperature loadability|Temperature stability|Temperature test|Testing |
| ICS: | 31.020 - Componentes electrónicos en general, 31.190 - Conjuntos de componentes eléctronicos |
| CTN: | |
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Equivalencia Internacional |
Idéntica EN 62137-4:2014/AC:2015 Idéntica IEC 62137-4:2014 |
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Reemplazo Normas |
Reemplaza a DIN EN 62137:2005-04 Reemplaza a DIN EN 62137-4:2013-01 |
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