DIN EN IEC 60749-20:2023-07
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2020); German version EN IEC 60749-20:2020 / Note: DIN EN 60749-20 (2010-04) remains valid alongside this standard until 2023-10-05.
| Fecha edición: |
2023-07-01
En Vigor
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| Idiomas disponibles: | Alemán |
| Resumen: | This part of DIN EN 60749 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. Dieser Teil der DIN EN 60749 legt ein Verfahren fest zum Bewerten der Lötwärmebeständigkeit von Halbleiterbauelementen, die als kunststoffverkappte oberflächenmontierbare Bauelemente (SMD) in Gehäusen montiert wurden. Dieses Prüfverfahren ist zerstörend. |
| Keywords: | Climatic tests|Components|Definitions|Destructive testing|Electrical engineering|Electronic engineering|Electronic equipment and components|Environmental testing|Integrated circuits|Mechanical testing|Moisture resistance|Plastics|Resistance|Semiconductor devices|Semiconductors|SMD|Soldering temperature resistance|Surface mounting|Surface mounting devices|Testing|Thermal stability |
| ICS: | 31.080.01 - Dispositivos semiconductores en general |
| CTN: | |
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Equivalencia Internacional |
Idéntica EN IEC 60749-20:2020 Idéntica IEC 60749-20:2020 |
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Reemplazo Normas |
Reemplaza a DIN EN 60749-20:2010-04 Reemplaza a DIN EN IEC 60749-20:2019-10 |
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