DIN EN IEC 60749-30:2023-02
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2020); German version EN IEC 60749-30:2020 / Note: DIN EN 60749-30 (2011-12) remains valid alongside this standard until 2023-09-21.
| Fecha edición: |
2023-02-01
En Vigor
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| Idiomas disponibles: | Alemán |
| Resumen: | This part of DIN EN 60749 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. Mit diesem Teil der DIN EN 60749 wird ein standardisiertes Verfahren eingeführt, mit welchem die Vorbehandlung (Preconditioning) vor Zuverlässigkeitsprüfungen von nicht hermetisch verkappten oberflächenmontierbaren Bauelementen (SMD) bestimmt wird. |
| Keywords: | Atmospheric pressure|Changes of temperature|Climate|Climatic|Climatic tests|Components|Definitions|Dimensions|Electrical engineering|Electrical measurement|Electronic engineering|Electronic equipment and components|Environment|Environmental testing|Environmental tests|Flammability|Heat|Integrated circuits|Mechanical testing|Moisture|Preconditioning|Reliability|Reliability testing|Resistance|Semiconductor devices|Semiconductors|SMD|Surface mounting|Temperature|Testing|Tightness|Visual inspection (testing) |
| ICS: | 31.080.01 - Dispositivos semiconductores en general |
| CTN: | |
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Equivalencia Internacional |
Idéntica EN IEC 60749-30:2020 Idéntica IEC 60749-30:2020 |
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Reemplazo Normas |
Reemplaza a DIN EN 60749-30:2011-12 Reemplaza a DIN EN IEC 60749-30:2019-09 |
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