DIN EN IEC 61188-6-1:2022-08
Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards (IEC 61188-6-1:2021); German version EN IEC 61188-6-1:2021 / Note: DIN EN 61188-5-1 (2003-06) remains valid alongside this standard until 2024-03-30.
| Fecha edición: |
2022-08-01
En Vigor
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| Idiomas disponibles: | Alemán |
| Resumen: | This International Standard specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1 to IEC 61191-4. Diese internationale Norm legt die Anforderungen an Lötflächen auf Leiterplatten fest. Dazu gehören Anschlussflächen und Anschlussflächenstruktur für Bauelemente für die Oberflächenmontage wie auch lötfähige Bohrbilder für Durchsteckbauteile. Diese Anforderungen basieren auf den Lötstellenanforderungen der Normen IEC 61191-1 bis IEC 61191-4. |
| Keywords: | Components|Definitions|Design|Drawings|Electrical engineering|Electronic engineering|Electronic equipment and components|Equipment|Land pattern|Printed circuits|Printed-circuit boards|Semiconductor devices|SMD|Solderings|Specification (approval)|Surface mounting |
| ICS: | 31.180 - Tarjetas y circuitos impresos, 31.190 - Conjuntos de componentes eléctronicos |
| CTN: | |
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Equivalencia Internacional |
Idéntica EN IEC 61188-6-1:2021 Idéntica IEC 61188-6-1:2021 |
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Reemplazo Normas |
Reemplaza a DIN EN 61188-5-1:2003-06 Reemplaza a DIN EN IEC 61188-6-1:2019-07 |
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