DIN EN IEC 61188-6-2:2023-03
Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD) (IEC 61188-6-2:2021); German version EN IEC 61188-6-2:2021
| Fecha edición: |
2023-03-01
En Vigor
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| Idiomas disponibles: | Alemán |
| Resumen: | This part of IEC 61188 describes the requirements of design and use for soldering surfaces of land pattern on circuit boards. This part includes land pattern for surface mounted components. These requirements are based on the solder joint requirements of the IEC 61191 series. Dieser Teil von IEC 61188 beschreibt die Anforderungen an die Konstruktion und Verwendung von Lötflächen von Anschlussflächenbilder auf Leiterplatten. Dieser Teil beinhaltet das Anschlussflächenbild für oberflächenmontierbare Bauelemente. Diese Anforderungen basieren auf den Lötverbindungsanforderungen der Normenreihe IEC 61191. |
| Keywords: | Design|Drawings|Electrical engineering|Electronic engineering|Electronic equipment and components|Equipment|Land pattern|Printed circuits|Printed-circuit boards|Semiconductor devices|SMD|Solderings|Specification (approval)|Surface mounting|Surface mounting devices|Tridimensional |
| ICS: | 31.180 - Tarjetas y circuitos impresos, 31.190 - Conjuntos de componentes eléctronicos |
| CTN: | |
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Equivalencia Internacional |
Idéntica EN IEC 61188-6-2:2021 Idéntica IEC 61188-6-2:2021 |
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Reemplazo Normas |
Reemplaza a DIN EN IEC 61188-6-2:2021-04 |










