DIN EN IEC 61189-2-805:2022-03
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-805: X/Y CTE Test for Thin Base Materials by TMA (IEC 91/1696/CD:2020); Text in German and English / Note: Date of issue 2022-02-18
| Fecha de anulación: |
2025-08-01
Anulada
|
|---|---|
| Idiomas disponibles: | Alemán, Inglés |
| Keywords: | Assemblies|Electrical components|Electrical engineering|Electrical insulating materials|Electronic equipment and components|Interconnection|Interconnection structures|Printed circuits|Printed-circuit boards|Stress|Testing|Testing conditions|Thermal expansion|Thin|Thin films|Thin-film technology |
| ICS: | 31.180 - Tarjetas y circuitos impresos |
| CTN: | |
|
Equivalencia Internacional |
Idéntica IEC 91/1696/CD (2020-12) |
|
Reemplazo Normas |
Es reemplazada por DIN EN IEC 61189-2-805:2025-08 |
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