DIN EN IEC 61189-2-807:2023-01
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA (IEC 61189-2-807:2021); German version EN IEC 61189-2-807:2021
| Fecha edición: |
2023-01-01
En Vigor
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| Idiomas disponibles: | Alemán |
| Resumen: | This International Standard specifies a test method to determine the decomposition temperature (Td) of base laminate materials using thermogravimetric analysis (TGA). Diese Internationale Norm legt ein Prüfverfahren zur Bestimmung der Zersetzungstemperatur (Td) von Basislaminatmaterialien mittels thermogravimetrischer Analyse (TGA) fest. |
| Keywords: | Assemblies|Decomposition|Electrical components|Electrical engineering|Electronic equipment and components|Interconnection|Interconnection structures|Printed circuits|Printed-circuit boards|Temperature|Testing|Thermogravimetric analysis|Thermogravimetry |
| ICS: | 31.180 - Tarjetas y circuitos impresos, 31.190 - Conjuntos de componentes eléctronicos |
| CTN: | |
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Equivalencia Internacional |
Idéntica EN IEC 61189-2-807:2021 Idéntica IEC 61189-2-807:2021 |
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Reemplazo Normas |
Reemplaza a DIN EN IEC 61189-2-807:2020-12 |
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