DIN EN IEC 61189-2-808:2025-08
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method (IEC 61189-2-808:2024); German version EN IEC 61189-2-808:2024
| Fecha edición: |
2025-08-01
En Vigor
|
|---|---|
| Idiomas disponibles: | Alemán |
| Keywords: | Assemblies|Dielectric|Electrical engineering|Electronic equipment and components|Heat flux|Interconnection|Interconnection structures|Printed circuits|Printed-circuit boards|Testing|Testing conditions|Thermal resistance|Transient |
| ICS: | 31.180 - Tarjetas y circuitos impresos |
| CTN: | |
|
Equivalencia Internacional |
Idéntica EN IEC 61189-2-808:2024 Idéntica IEC 61189-2-808:2024 |
|
Reemplazo Normas |
Reemplaza a DIN EN IEC 61189-2-808:2022-03 |
Normas citadas
Libros relacionados
Normas relacionadas
Colecciones temáticas relacionadas
