DIN EN IEC 61189-2-808:2025-08
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method (IEC 61189-2-808:2024); German version EN IEC 61189-2-808:2024
| Fecha edición: |
2025-08-01
En Vigor
|
|---|---|
| Idiomas disponibles: | Alemán |
| Resumen: | This document is applicable to test thermal resistance of dielectric layer of printed circuit board using thermal transient method. Dieses Dokument ist anwendbar, um den thermischen Widerstand der dielektrischen Schicht von Leiterplatten mit thermischer Transientenmethode zu prüfen. |
| Keywords: | Assemblies|Dielectric|Electrical engineering|Electronic equipment and components|Heat flux|Interconnection|Interconnection structures|Printed circuits|Printed-circuit boards|Testing|Testing conditions|Thermal resistance|Transient |
| ICS: | 31.180 - Tarjetas y circuitos impresos |
| CTN: | |
|
Equivalencia Internacional |
Idéntica EN IEC 61189-2-808:2024 Idéntica IEC 61189-2-808:2024 |
|
Reemplazo Normas |
Reemplaza a DIN EN IEC 61189-2-808:2022-03 |
Normas citadas
Libros relacionados
Normas relacionadas
Colecciones temáticas relacionadas
