DIN EN ISO 9453:2021-01
Soft solder alloys - Chemical compositions and forms (ISO 9453:2020); German version EN ISO 9453:2020
| Fecha edición: |
2021-01-01
En Vigor
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|---|---|
| Idiomas disponibles: | Inglés, Alemán |
| Resumen: | This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium. An indication of the forms generally available is also included. |
| Keywords: | Alloys|Chemical composition|Definitions|Fillers|Form of delivery|Marking|Packages|Sampling methods|Shape|Soft solders|Solders|Sounding heads|Specifications|Tin-containing alloys|Welding engineering |
| ICS: | 25.160.50 - Soldeo fuerte y blando |
| CTN: | |
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Equivalencia Internacional |
Idéntica EN ISO 9453:2020 Idéntica ISO 9453:2020 |
|
Reemplazo Normas |
Reemplaza a DIN EN ISO 9453:2014-12 Reemplaza a DIN EN ISO 9453:2019-10 |
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