DIN EN ISO 9455-14:2017-12
Soft soldering fluxes - Test methods - Part 14: Assessment of tackiness of flux residues (ISO 9455-14:2017); German version EN ISO 9455-14:2017
| Fecha edición: |
2017-12-01
En Vigor
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|---|---|
| Idiomas disponibles: | Inglés, Alemán |
| Resumen: | The document specifies a qualitative method for the assessment of the tackiness of the residues of a soft soldering flux after a soldering process. The method is applicable to all fluxes, solder pastes and flux cored solder wires. |
| Keywords: | Adhesion|Adhesive force|Bonding|Determination|Fluxes (materials)|Physical testing|Residues|Soldering|Solderings|Testing|Welding|Welding engineering|Welding fillers |
| ICS: | 25.160.50 - Soldeo fuerte y blando |
| CTN: | |
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Equivalencia Internacional |
Idéntica EN ISO 9455-14:2017 Idéntica ISO 9455-14:2017 |
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Reemplazo Normas |
Reemplaza a DIN EN 29455-14:1994-02 Reemplaza a DIN EN ISO 9455-14:2016-09 |
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