DIN IEC 60249-3-3:1994-06
Base materials for printed circuits; part 3: special materials; specification No. 3: permanent polymer coating materials (solder-resist) for use in the fabrication of printed boards; identical with IEC 60249-3-3:1991
| Fecha edición: |
1994-06-01
En Vigor
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|---|---|
| Idiomas disponibles: | Alemán |
| Resumen: | The document gives the test methods, conditions and requirements for solder resist material as manufactured and for a solder resist system which comprises the material, the application process, and a printed board. Das Dokument enthält Prüfverfahren, Konditionierungen und Anforderungen für Lötabdeckmaterialien im Anlieferungszustand sowie für Lötabdecksysteme, welche das Abdeckmaterial, das Beschichtungsverfahren und die Leiterplatte umfassen. |
| Keywords: | Base materials|Coatings|Conditioning|Covers|Electrical engineering|Electronic engineering|Electronic equipment and components|Materials|Polymers|Printed circuits|Printed-circuit bases|Printed-circuit boards|Production|Protective coatings|Solder resist|Solder resists|Special materials|Testing |
| ICS: | 31.180 - Tarjetas y circuitos impresos |
| CTN: | |
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Equivalencia Internacional |
Idéntica IEC 60249-3-3:1991 |
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