DIN IEC/TS 62647-2:2013-09;DIN SPEC 42647-2:2013-09
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin (IEC/TS 62647-2:2012)
| Fecha edición: |
2013-09-01
En Vigor
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| Idiomas disponibles: | Alemán |
| Resumen: | This Technical Specification establishes processes for documenting the mitigating steps taken to reduce the harmful effects of Pb-free tin in electronic systems. Diese Technische Spezifikation legt Prozesse für die Dokumentation der Maßnahmen zur Verringerung der gefährlichen Auswirkungen von bleifreiem Zinn in elektronischen Systemen fest. |
| Keywords: | Aeronautical engineering|Aerospace transport|Air transport|Components|Consumer-supplier relations|Definitions|Documentation|Electrical safety|Electronic equipment and components|Electronic products|Electronic systems|Finishes|Heavy-duty|High capacity|Information technology|Lead free|Performance|Protection against electric shocks|Public administration|Solders|Space technology|Tin |
| ICS: | 25.160.50 - Soldeo fuerte y blando, 31.020 - Componentes electrónicos en general, 49.035 - Componentes para la construcción aeroespacial |
| CTN: | |
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Reemplazo Normas |
Reemplaza a DIN IEC/TS 62647-2:2012-04;DIN SPEC 42647-2:2012-04 |
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