IEC 60691:2023+AMD1:2024+AMD2:2026 CSV
Thermal-links - Requirements and application guide
| Fecha edición: |
2026-02-09
En Vigor
|
|---|---|
| Idiomas disponibles: | Inglés |
| Resumen: | IEC 60691:2023+AMD1:2024+AMD2:2026 CSV is applicable to thermal-links intended for incorporation in electrical appliances, electronic equipment and component parts thereof, normally intended for use indoors, in order to protect them against excessive temperatures under abnormal conditions. NOTE 1 The equipment is not designed to generate heat. NOTE 2 The effectiveness of the protection against excessive temperatures logically depends upon the position and method of mounting of the thermal-link, as well as upon the current which it is carrying. This document may be applicable to thermal-links for use under conditions other than indoors, provided that the climatic and other circumstances in the immediate surroundings of such thermal-links are comparable with those in this standard. This document may be applicable to thermal-links in their simplest forms (e.g. melting strips or wires), provided that molten materials expelled during function cannot adversely interfere with the safe use of the equipment, especially in the case of hand-held or portable equipment, irrespective of its position. |
| ICS: | 29.120.50 - Fusibles y otros dispositivos de protección contra sobreintensidades |
| CTN: | TC 32/SC 32C - 1339 |
|
Anulaciones Normas |
Anula a IEC 60691:2015 Anula a IEC 60691:2015/COR1:2016 Anula a IEC 60691:2015/AMD1:2019 |
|
Modificaciones Normas |
Es modificada por IEC 60691:2023/AMD1:2024 Es modificada por IEC 60691:2023/AMD2:2026 |
|
Otras Relaciones |
Acuerdo de Frankfurt FprEN IEC 60691:2022 |
Normas citadas
Libros relacionados
Normas relacionadas
Colecciones temáticas relacionadas
