IEC TR 61189-5-506:2019
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-506: General test methods for materials and assemblies - An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501
| Fecha edición: |
2019-06-26
En Vigor
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| Idiomas disponibles: | Inglés |
| ICS: | 31.180 - Tarjetas y circuitos impresos |
| CTN: | 1286 |
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