IEEE White Paper
The Automotive Industry in Turmoil—Chiplets to the Rescue?
| Fecha edición: |
2026-05-12
En Vigor
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| Idiomas disponibles: | Inglés |
| Keywords: | automotive|chiplet|Industry Connections|MaaS|mobility as a service|standards development|supply chain |
| Scope: | - Active. The automotive industry is at a technological inflection point as increasing system complexity, performance demands, and cost pressures expose the limitations of traditional monolithic SoC‑based ECU architectures. The transition toward centralized, high‑performance, server‑like vehicle computing motivates the adoption of alternative design approaches. This white paper summarizes insights from the IEEE MaaS webinar “Mind the Gaps: The Automotive Industry in Turmoil – Chiplets to the Rescue?” (March 5, 2025), examining the potential of chiplet‑based architectures for automotive applications. It highlights enabling standards such as Universal Chiplet Interconnect Express (UCIe), Bunch of Wires (BoW), and Advanced Interface Bus (AiB), and discusses the system‑level implications for packaging, reliability, and supply‑chain adaptation |
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